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TSMC Board of Directors Approves Funding to Enter Solid State Lighting Market

Nov 10, 2009

TSMC


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TSMC Board of Directors Resolutions

Issued by: TSMC
Issued on: 2009/11/10


Hsinchu, Taiwan, R.O.C., November 10, 2009 –TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

1. Approved capital appropriations of US$2,240.8 million to expand advanced technology capacity for twelve-inch wafer fabs, and increase twelve-inch capacity for wafer level chip scale packaging process.

2. Approved capital appropriations of US$254.6 million to expand 12-inch wafer fab facilities.

3. Approved capital appropriations of US$46 million to set up a production line and product development lab for solid state lighting.

4. Appointed Dr. Jack Sun as Chief Technology Officer of TSMC, in charge of formulating TSMC’s technology strategy and conducting the development of the company’s most advanced technologies. Dr. Sun will report directly to Dr. S.Y. Chiang, Senior Vice President of Research and Development.



TSMC Spokesperson
Lora Ho
Vice President & Chief Financial Officer & Spokesperson
Tel: 886-3-5664602

TSMC Deputy Spokesperson
J.H. Tzeng
Deputy Director, PR Department
Tel: 886-3-5055028
Fax: 886-3-5670121
Mobile: 886-928-882-607
Email: jhtzeng@tsmc.com

For further information, please contact
Richard Chung
Technical Manager
Tel: 886-3-563-6688 ext. 712-5038
Fax: 886-3-5670121
Mobile: 886-911-258-751
Email: cychung@tsmc.com



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