Boise/Idaho, July 3, 2009 – SemiLEDs Corp. a world leader in manufacturing high power LEDs, announced the opening of a third production facility in Hsin-Chu Science Park, Taiwan. This new production facility brings SemiLEDs’ capacity to 15 million 1x1mm high power LED chips per month.
SemiLEDs’ LED chips are manufactured and processed using a unique and proprietary MvpLED process that enables the best thermal resistance on the market (0.4°C/W) as well as providing various optical and electrical advantages. Packaged LEDs using SemiLEDs 1x1mm chips typically produce over 110 lumens at 5000K and 350mA.
“We are pleased to launch our new LED production facility. Along with our ongoing collaboration with Aixtron on 6 inch wafers, this new facility will enhance our power LED capacity and allow us to stay ahead of ever increasing demand.” Said Trung Doan, CEO of SemiLEDs. “We are also very proud that our LEDs maintain the lowest Carbon footprint on the market due to our Sapphire reclamation process.”
SemiLEDs’ LED chips in blue, green and UV have been gaining tremendous demand from LED packagers and chip-on-board integrators due to their vertical structure, industry leading thermal resistance and low forward voltage, all of which contribute greatly to efficiency and reliability.
SemiLEDs is a US based manufacturer of ultra-high bright LED chips with state of the art fabrication facilities in Hsinchu Science Park, Taiwan. SemiLEDs specializes in the development and manufacturing of vertical LED chips in blue(white), green and UV using a patented copper alloy base. This unique design allows for higher performance and longer lumen maintenance. SemiLEDs high power MvpLEDs deliver over 110lm/W. In December 2008 The World Economic Forum recognized SemiLEDs innovations with the 2009 Technology Pioneer Award. Please visit http://www.semileds.com/.