The Computational Fluid Dynamic (CFD) modeling of light emitting diode (LED) components becomes increasingly
more important as CFD spreads into the design process. This paper compares the results of Avago’s high power LED package (ASMT-MX00) on MCPCB and double layer FR4 substrate with heat sink, to experimental
data. After the comparison discussion, a thermal modeling technique for LED package with heat sink is noted. Results are quite impressive, indicating that this technique can be used for LED system levels.